Devices and systems for inductive transfer of electrical energy

ABSTRACT

Devices and systems are described for inductively charging a portable electronic device, such as a tracking device, and for communicatively coupling the portable electronic device to a computer monitoring station or other computing device.

RELATED APPLICATIONS

This application is a continuation of, claims priority to, and herebyincorporates by reference in its entirety U.S. patent application Ser.No. 11/933,024 filed on Oct. 31, 2007, entitled “Apparatus and Methodfor Manufacturing an Electronic Package.” This application alsoincorporates by reference in its entirety U.S. patent application Ser.No. 11/753,979 filed on May 25, 2007, entitled “Apparatus and Method forProviding Location Information on Individuals and Objects Using TrackingDevices.”

BACKGROUND

An electronic tracking device is often defined in part by its ability toreplenish its battery level and as well as provide a means of efficientdata transfer, e.g., when a device battery is charging and may beelectrically connected to a remote terminal, such as a locationcoordinate monitoring station. Many conventional electronic trackingdevices' power replenish and recharge capabilities are limited tophysically plugging a port of the electronic tracking device into astandard electrical wall outlet or computer device port. In someinstances, physical replacement of a device battery is required.Furthermore, many conventional electronic tracking devices providesignal transfer capability that is limited to direct connection of theelectronic tracking device to a sub-station or central locationcoordinate monitoring station.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 illustrates an electrical block diagram of a tracking device inaccordance with an embodiment of the present invention.

FIG. 2A illustrates a perspective top view of a mold tool to produce anelectronic package for an electrical component in accordance with anembodiment of the present invention.

FIG. 2B illustrates a side view of a mold tool to inject a thermoplasticresin into a first fill area in accordance with an embodiment of thepresent invention.

FIG. 2C illustrates a side view of a mold tool to inject a thermoplasticresin into a second fill area in accordance with an embodiment of thepresent invention.

FIG. 2D illustrates a perspective view of a PCB illustrated in FIGS.2A-2C for electronic packaging in accordance with an embodiment of thepresent invention.

FIG. 2E illustrates a side view of an electronic package produced bymolding tools shown in FIGS. 2A-2C in accordance with an embodiment ofthe present invention.

FIG. 2F illustrates a two-piece mating electronic package produced usingthe processing steps described with reference to FIGS. 2A-2E inaccordance with an embodiment of the present invention.

FIG. 3A illustrates a diversity antenna located on a first side of atracking device to support message communication in accordance with anembodiment of the present invention.

FIG. 3B illustrates a diversity antenna located on a second side of atracking device to support message communication in accordance with anembodiment of the present invention.

FIG. 4A illustrates wireless battery charging circuitry of a trackingdevice and an inductive charging pad in accordance with an embodiment ofthe present invention.

FIG. 4B illustrates wireless battery charging circuitry of a trackingdevice and a dual-sided inductive charging unit in accordance with anembodiment of the present invention.

FIG. 4C illustrates wireless battery charging circuitry of a trackingdevice and a first conformal-shaped inductive charger in accordance withan embodiment of the present invention.

FIG. 4D illustrates wireless battery charging circuitry of a trackingdevice and a second conformal-shaped inductive charger in accordancewith an embodiment of the present invention.

FIG. 4E illustrates wired battery charging connection of a trackingdevice in accordance with an embodiment of the present invention.

FIG. 5 illustrates a flow chart of the injection molding process inaccordance with one embodiment of the present invention.

FIG. 6 illustrates a flow chart to manage battery power usage of atracking device in accordance with one embodiment of the presentinvention.

DETAILED DESCRIPTION

Reference is now made to the drawings wherein like numerals refer tolike parts throughout.

As used herein, the terms “location coordinates” refer withoutlimitation to any set or partial set of integer, real and/or complexlocation data or information such as longitudinal, latitudinal, andelevational positional coordinates.

As used herein, the terms “tracking device” refers to without limitationto any hybrid electronic circuit, integrated circuit (IC), chip, chipset, system-on-a-chip, microwave integrated circuit (MIC), MonolithicMicrowave Integrated Circuit (MMIC), 10 low noise amplifier, poweramplifier, transceiver, receiver, transmitter and Application SpecificIntegrated Circuit (ASIC) that may be constructed and/or fabricated. Thechip or IC may be constructed (“fabricated”) on a small rectangle (a“die”) cut from, for example, a Silicon (or special applications,Sapphire), Gallium Arsenide, or Indium Phosphide wafer. The IC may beclassified, for example, into analogue, digital, or hybrid (bothanalogue and digital on the same chip and/or analog-to-digitalconverter). Digital integrated circuits may contain anything from one tomillions of logic gates, invertors, and, or, nand, and nor gates,flipflops, multiplexors, etc. on a few square millimeters. The smallsize of these circuits allows high speed, low power dissipation, andreduced manufacturing cost compared with board-level integration.

As used herein, the terms “wireless data transfer”, “wireless trackingand location system”, “positioning system,” and “wireless positioningsystem” refer without limitation to any wireless system that transfersand/or determines location coordinates using one or more devices, suchas Global Positioning System (GPS). The terms “Global PositioningSystem” refer to without limitation to any services, methods or devicesthat utilize GPS technology that determine a position of a GPS receiverbased on measuring signal transfer times between satellites having knownpositions and the GPS receiver. The signal transfer time of a signal isproportional to a distance of a respective satellite from the GPSreceiver. The distance between a satellite and a GPS receiver may beconverted, utilizing signal propagation velocity, into a respectivesignal transfer time. The positional information of the GPS receiver iscalculated based on distance calculations from at least four satellitesto determine positional information of the GPS receiver.

As used herein, the terms “wireless network” refers to, withoutlimitation, any digital, analog, microwave, and millimeter wavecommunication networks that transfer signals from one location toanother location, such as IEEE 802.11g, Bluetooth, WiMax, GSM, IS-95,CGM, CDMA, wCDMA, PDC, UMTS, TDMA, FDMA, two-way satellitecommunications or any combinations thereof.

Major Features

In one aspect, the present invention discloses an apparatus and methodof providing an electronic packaging apparatus using an injectionmolding process to manufacture a substantially shockproof, waterproofunit for a tracking device. In one embodiment, the unit provides adiversity antenna capable of improving receiver sensitivity. In oneembodiment, the unit prevents unauthorized reverse engineering ofelectronic components contained therein. In other embodiment, inductivecircuitry enables near-field wireless charging and data communicationbetween a tracking device and a battery charger and/or a remotemonitoring station to potentially improve user ease of use and decreasea user's communication costs. As described though out the followingspecification, the present invention generally provides packaging oftracking devices for locating and tracking an individual or an object.More specifically, the package of the present invention is substantiallydurable in nature to withstand harsh environmental conditions and/orhard surface impacts that may occur before location is determined of amissing, lost, or abducted person, Alzheimer's syndrome patient,mentally ill person, or a criminal by a guardian or law enforcementauthority.

The present invention may be used to provide a package for a trackingdevice concealed on an individual in one (or more) form factor(s). Formfactors may include a pen carried in a pocket or backpack, an innersurface of a shoe, a button, a necklace, a toy, a shirt collar, anddecoration, fabric of a jacket or sweater, or the like. Various deviceskins are available to camouflage a tracking device. A device skin, suchas a plastic sticker or housing, attaches to a tracking device to blenda tracking device appearance with that of an object or individual toprevent discovery by an abductor (as compared to being incorporated aspart of a conspicuous device, e.g., a mobile phone, pager, personal dataassistant). In one exemplary embodiment, the tracking device may be apersonal locator device implanted under an individual's skin. Thepersonal locating device may, in one example, have capability ofinductively charging its battery, for instance, utilizing an inductivecharging technology, methodology or apparatus described supra in FIGS.4A-4D. In one variant, a battery of a personal locator tracking devicemay be trickle-charged in response to an individual movement's (e.g.using technology similar to a flashlight that charges its battery levelin response to user providing a shaking or back and forth motion to theflashlight).

The present invention discloses, in one embodiment, a substantiallywaterproof and shockproof device and, in one instance, substantiallysealed and having no exposed metal contacts. Consequently, if thetracking device is submerged in water (such as when the tracking deviceis inadvertently washed in a washing machine as part of laundry) orexposed to cold temperature conditions, e.g., snow, the device remainsfunctional. The tracking device may also find use monitoring andlocating lost or stolen animals and objects, such as vehicles, goods andmerchandise. Please note that the following discussions of manufacturinga tracking device to monitor and locate individuals is nonlimiting andthe present invention may be useful in other electronic packagingapplications, such as watches, calculators, clocks, computer keyboards,computer mice, mobile phones and the like.

Exemplary Apparatus

Referring now to FIGS. 1-5, exemplary embodiments of the electronicpackaging system of the invention are described in detail. It will beappreciated that while described primarily in the context of trackingindividuals or objects, at least portions of the apparatus and methodsdescribed herein may be used in other applications, such as, utilized,without limitation, for control systems that monitor components such astransducers, sensors, and electrical and/or optical components that arepart of an assembly line process. Moreover, it will be recognized thatthe present invention may find utility beyond purely tracking andmonitoring concerns. Myriad of other functions will be recognized bythose of ordinary skill in the art given the present disclosure.

Electronic Packaging

Referring to FIG. 1, the electronic components 141 insert into the moldtooling 240 (depicted in FIG. 2A). The electronic components 141 includea signal receiver 144, a signal transmitter 146, and amicroprocessor/logic circuit 148. In one embodiment, the electroniccomponents 141 are disposed, deposited, or mounted on a substrate (suchas a circuit board (PCB) 143). The PCB 143, for example, may bemanufactured from: polyacryclic (P A), polycarbonate, (PC) composite andarylonitrilebutadiene-styrene (ABS) substrates, blends or combinationsthereof, or the like. The microprocessor/logic circuit 148 is configuredto store a first identification code (of the tracking device 142),produce a second identification code, determine location coordinates ofthe tracking device 142 and generate a positioning signal that containslocation data (as described in U.S. patent application Ser. No.11/753,979 filed on May 25, 2007, previously incorporated herein byreference). For instance, the location data includes longitudinal,latitudinal, and elevational position of a tracking device, currentaddress or recent address of the tracking device, a nearby landmark tothe tracking device, and the like.

In one embodiment, a positioning system logic circuit, e.g., wirelesslocation and tracking logic circuit 150, calculates location data sentto the microprocessor/logic circuit 148 from a monitoring station 151.Memory1 153 a and memory2 153 b store operating software and data, forinstance, communicated to and from the microprocessor/logic circuit 148and/or the wireless location and tracking logic circuit 150. A powerlevel sensor 149 detects a receive signal power level. Signal detectingcircuitry 155 detects a battery level of battery 154, which may containone or more individual units or be grouped as a single unit. One or moreantennas 152 a, 152 b connect, in this example, to the signaltransmitter 146 and the signal receiver 144. In one variant, the signaltransmitter 146 and the signal receiver 144 may be replaced by atransceiver circuit, chip, or integrated circuit. The signal transmitter146 transmits a signal including location data from a tracking device142 to the monitoring station 151. The signal receiver 144 receives asignal from the monitoring station 151, for example, by wireless datatransfer, e.g., wireless telephone communication or via an Internetelectronic message. A demodulator circuit 159 extracts baseband signals,for instance at 100 KHz, including tracking device configuration andsoftware updates, as well as converts a low-frequency AC signal to a DCvoltage level. The DC voltage level, in one example, is supplied tobattery charging circuitry 157 to recharge a battery level of thebattery 154. The blocks 131 a-d, in this example, represents batterycharging components (such as inductors 408 a-d described supra withreference to FIGS. 4A-4D).

In one embodiment, a user of a monitoring station 151 by listening (ordownloading) one or more advertisements may reduce and/or shift phoneusage charges to another user, account, or database (as disclosed inU.S. patent application Ser. No. 11/784,400 entitled “CommunicationSystem and Method Including Dual Mode Capability” and 111784,318entitled “Communication System and Method Including CommunicationBilling Options” each filed on Apr. 5, 2007, herein incorporated byreference).

Referring to FIG. 2A, a mold tool 240 supports the PCB board 143(including the electronic components 141 shown in FIG. 1) in accordancewith an embodiment of the present invention. Retractable pins 256 a-dsupport the PCB 143 within the mold tooling 240. The mold tooling 240,in this non-limiting example, produces a tracking device 142 to conformto a desired electronic package shape, for example, a shape of a button.Furthermore, the molding tool 240, in another example, forms thetracking devices 402, 410 (from the application Ser. No. 11/753,979incorporated previously by reference). In other embodiments,dimensionality of a mold tool conforms to a desired tracking devicedimensionality, e.g., a lapel pin, button, shirt collar, shoe insert,pen, belt buckle and the like.

The following is a non-limiting example of the present invention. Themold tool 240 includes one or more molds (e.g., first mold 237 a, secondmold 237 b, third mold 238 a, fourth mold 238 b) forming one or moreinternal cavity areas, such as molding areas 239 a, 239 b shown in FIG.2B, 2C, respectively. A plastic composite material is flowed into themolding areas 239 a, 239 b to encapsulate, e.g., substantially seal, thetracking device 142. In one embodiment, the plastic composite materialflows through at least one of the openings 258 a, 258 b to fill, forinstance, the molding area 239 a and/or the molding area 239 b. If aprinted circuit board was utilized, e.g., PCB 143, the PCB may be formedby any of the following: a polycarbonate acrylic-styrene (PCI ABS),polycarbonate (PC), acrylic-styrene (ABS) chemical composition, polymer,polyurethane, polycarbonateurethane (PCU), thermoplastic, or blendsthereof. For encapsulating the tracking device 142 using one or moremolds, the plastic composite material, for example, may be a thermosetplastic, thermoplastic resin, polymer, polycarbonate, elastomer,urethane, urethane elastomer, polyurethane, copolymers, thermoplasticvulcanizates, thermoplastic urethanes, olefinics, copolyamides,arylonitrile-butadiene-styrene (ABS), or blends thereof.

Processing properties of the plastic composite material include melttemperature, mold temperature, mold dimensionality and injectionpressure. The processing properties, for instance, depend on amanufacturing lot and material composition as well as whether electroniccomponents 141 to encapsulate are one or more integrated circuits or aPCB 143. In this non-limiting example, manufacturer specificationsconform to those by Bayer Polymers, the Polymer Technology Group and theTeknor Apex Company. More specifically, urethane elastomer processingparameters include a melt temperature between 150 to 250 degrees C., amold temperature between 30 to 45 degrees C., and an injection pressurebetween 30 to 50 MPa. A drying process may follow opening of first mold237 a, 237 b and/or second mold 238 a, 238 b and removal of the trackingdevice 142. Afterwards, the tracking device 142 substantially replicatesa combined form factor of first mold 237 a, a second mold 237 b, a thirdmold 238 a, and fourth mold 238 b. Consequently, the tracking device 142conforms to physical features (e.g., belt buckles, button on a shirt,inner surface of a shoe, or the like) of the mold tooling.

Referring to FIG. 2B, one or more electronic components 141, such aspackaged integrated circuits, resistors and capacitors, disposed on aPCB (such as PCB 143) are encapsulated in the first molding process. Inparticular, during the first molding process, a first mold 237 a and asecond mold 237 b form a cavity, e.g., a first fill area 239 a, to filla first region on the PCB 143 using a plastic composite material, e.g.,selected from the materials described above. In this example, the firstregion includes an active region of the electronic components 141.Referring to FIG. 2C, in a second molding process, a third mold 238 aand fourth mold 238 b form a second region. The second region, forinstance, is a second fill area 239 b. The second fill area 239 b, forexample, is an area about an outer region of the first filling area 339a for filing with a plastic composite material, to further process thePCB 143 coated with a first fill area 239 a.

Following one or more of the molding processes, for instance the firstand the second molding process, an injection step may be required tointermediately cure the plastic composite material. This curing step mayinclude having the composite plastic material remain in a mold untilsufficient hardening occurs, or it may include a sequence of steps ofactively heating or cooling the plastic composite material within oroutside of the mold to achieve a desired uniformity and consistency. Forinstance, if the composite plastic material is a thermoset plasticmaterial, the curing step may be automatic due to its inherent chemicalproperties. For thermoset plastic material, however, it may be generallyadvantageous to cool to hasten its solidification.

In one embodiment, retractable pins 256 a-d, shown in FIG. 2A, arecapable of providing PCB 143 support during injection mold processing.In one embodiment, injection mold may involve a sequential or parallelarrangement of injections of one or more plastic composite materials,(e.g., chemical compositions and/or varieties of a heated thermoplasticresin) to fill areas (e.g., fill area 239 a, fill area 239 b) on the PCB143. In one embodiment, an integrated circuit, such as circuits 146, 150depicted in FIG. 1, are sealed in a first fill area 239 a during a firstmolding process. The first molding process may include a plasticcomposite material of a first type. Thus, advantageously, subsequentmolding processes, such as a second molding process, having a secondfill area 239 b, may, in one embodiment, utilize a plastic compositematerial of the first type or, in the alternative, a second type, e.g.,optimized for a property different than the first type.

For instance, the second fill area 239 b may be optimized for moistureand chemical resistance properties and the first fill area 239 a may beoptimized for high resistance to breakage and stress. Consequently, thisinvention, in one embodiment, by using multiple types, multiple levelpolymers, injection processing may provide custom injection tailoring onper unit area basis on the PCB 143 to achieve one or more desiredelectronic packaging properties. The electronic packaging properties mayinclude tensile strength, hardness, and flexural modulus, tear strength,coefficient of temperature expansion, flammability, brittleness, linearmold shrinkage, specific gravity and melt flow. Thus, this embodiment ofcustom tailored layering as opposed to conventional single applicationpolymer processing provides a tracking device having a non-uniformprofile wireless communication conducting packages.

Furthermore, the present process eliminates a need for first sealing anintegrated circuit, e.g., before beginning an injection processing, suchas requiring an integrated circuit to be packaged in a ferrite, ceramiclead package, or the like to prevent circuitry degradation. Thus,multiple level sealing process of an electronic circuit (such aselectronic components 141) using the present invention provides forimproved electronic package throughput and improved package performance,e.g., improved electrostatic discharge (ESD) protection for activedevices, disposed in a first fill area 239 a. Still other advantages ofthe present processing include improved communication properties forelectronic components, such as electronic components 141. In oneembodiment, a system designer places signal communicating apparatus,e.g., antennas 152 a, 152 b proximate to the electrical components 141in a first fill area. In yet another embodiment, the signalcommunication apparatus, e.g., antennas 152 a, 152 b may be disposed(external to the first fill area) within a second fill area 239 b. Thus,a user may selectively choose a plastic composite material in the firstfill area 239 a to improve wireless communication (e.g., provideincreased signal isolation) for signal sensitive components.Furthermore, a user may choose a second fill area 239 b for improvesignal reception (for instance if the signal communication apparatus(e.g., antennas 152 a, 152 b are present in this area) or to enhanceother electronic properties such as filtering, tensile strength, ordensity modulus in a second fill area 239 b.

In one embodiment, the second fill area 239 b may be disposed with ametallic 25 material forming a multiple surface patch antenna, e.g.,dual patch antennas 152 a, 152 b, to improve receiver sensitivity and/orimprove signal reception (see FIG. 3 for a more detailed discussion ofthe dual patch antenna 152 a, 152 b). In one variant, multiple fillingareas, such as the first fill area 239 a, near the electronic components141 may be processed at a lower temperature and pressure, cooled, andimpurities and air bubbles removed from the electronic components 141.Continuing with this same variant, processing of a second fill area 239b proximate to (e.g., surrounding the first fill area 239 b) may proceedat a higher temperature with minimal degradation to the integratedcircuit because the first fill area 239 a forms a protective heatbarrier for heat sensitive integrated circuits, e.g., circuits 146, 150shown in FIG. 1. In one variant, the first fill area 239 a has a highertemperature resistance than a temperature capability of the integratedcircuit mounted on the PCB 143 (but a lower temperature resistance thanthe second fill area 239 b); therefore, the integrated circuits, e.g.,circuits 146, 150, as shown in FIG. 1, are protected from a highertemperature injection material, for instance, utilized to fill thesecond fill area 239 b, e.g., including antennas 152 a, 152 b.

In another embodiment, if more than one injector applies the moldingmaterial, a plastic composite material mass flow rate distribution maybe realized having a more uniform distribution; thus, board materialsand electrical components may be subjected to reduced tensile pressureper unit area, e.g., preventing damage, for instance, of a PCB 143 andthe integrated circuits, e.g., circuits 146, 150. As such, the presentinvention advantageously provides a lower pressure resin mass flow rateand more uniform plastic composite material application than aconventional mold tool utilizing a single injector entry, singleapplication molding, and a single injector exit port.

In another non-limiting example, the plastic composite material, in oneexample, includes a filler material or weighing material, that bundleswith, for example, a binder disposed in or with the plastic compositematerial. In one variant, a filler material, such as a glass fiber,glass ball or carbon fiber being chopped and applied to the plasticcomposite material, e.g., such as polycarbonate andacrylonitrile-butadiene-styrene (ABS) copolymer or others listed above.In one embodiment, the glass fiber or glass balls have a low dielectricconstant, e.g., approximately 2.2. Continuing with this variant, thefiller material provides have a low-loss tangent at signal transmissionfrequencies (such as at CDMA and GSM frequency ranges) to enhanceelectrical signal conductivity, such as for antennas 152 a, 152 b.Furthermore, the filler material should maintain a high tensile strengthto prevent electronic package breakage if inadvertently struck against ahard or sharp surface.

One advantage of the present invention packaging approach is the plasticcomposite material bonds directly to the electronics components 141 toform a tracking device 142 having an enclosed package that issubstantially hermetically sealed. In one embodiment, if the trackingdevice 142 is discovered by an assailant, it would be difficult to viewits internal components, because attempted removal of the plasticcomposite material (e.g., flowed over the PCB 143) would substantiallydestroy electronic circuits 141. Thus, it would be difficult to inspectthe electronic components 141, as compared to conventional electronicpackages having a lid or an encapsulated package where removal of thepackage causes minimal damage to any electronic components disposedtherein.

Furthermore, the disclosed packaging approach is resistant to failure ofelectronic components 141 being dropped as compared to conventionalelectronic packages having poor resistance to shock, vibration,moisture, and other environmental factors (e.g., snow). Because of thisdurability, the tracking device 142, for instance, may be incorporatedon child's person, such as part of a shoe or in a collar of a child'sshirt, that may strike an object, be accidentally placed in a clotheswashing machine, or be exposed to water.

Another advantage is the thermoplastic resin color and/or texture may beselected to match a particular design or pattern. The resin color andtexture, in one instance, blends or camouflages the tracking device 142in its surroundings. In one embodiment, in contrast to many conventionaltracking devices having a highly distinguishable and noticeable (e.g.,by would be assailant), the size, style and color of the tracking device(such as tracking device 142) blends as part of a room decoration orroom ornament, so if discarded by an individual (to prevent detection)its design is disguised to prevent destruction by an assailant (and toprovide last know location to a monitoring device terminal). In anotherembodiment, as compared to many conventional tracking devices, thetracking device 142 is substantially water impermeable and resistant toenvironmental conditions, such as rain, snow, wind and vibration.

Referring to FIG. 2D, electronic packaging process described above inFIGS. 2A-2C, may be modified to provide packaging for temperaturesensitive electronic components. Temperature sensitive electroniccomponents may include a Low Noise Amplifier (LNA), RF Transceiver unit(RF transceiver), or Central Processing Unit (CPU) produced from a heatsensitive or temperature sensitive material. The electronic packagingprocess described above is modified to form an electronic trackingpackage in two mating sections, e.g., sections 264, 266. Each matingsection 264, 266 is formed utilizing one plastic perform unit having asubstantially identical footprint (e.g., backside, front side,thickness, and the like) of the electrical circuit board, such as PCB143, to insert therein except that the perform unit includesadditionally dimensionality conforming to a desired shape of a matinglip 260, or a seam 262. After producing both mating sections 264, 266,the perform unit is removed. Electronics components 141 populate themating sections 264, 266 (including the antennas 152 a, 152 b) as wellas other components. The mating sections 264, 266 are snapped or gluedtogether, e.g., using a commercially available epoxy composition, alongthe mating lip 260 or seam 262, to form a substantially sealed,polycarbonate electronic package.

Antenna Design

Referring to FIG. 3, a multi-patch antenna, e.g., microstrip patchantennas 152 a, 152 b, in one example, disposed proximately toelectronic package surfaces 105, 107. In one embodiment, the microstrippatch antennas 152 a, 152 b are positioned parallel on opposing faces ofthe tracking device 142. In one embodiment, the microstrip patchantennas 152 a, 152 b are quarter-wave length microstrip patchesdeposited on an alumina substrate. In one example, the operatingfrequency range of the microstrip patch antenna is 3 GHz, but may beselected to support an operating frequency range of a skyward satelliteor an RF base station. In one example, a separation distance betweenparallel microstrip patch antennas 152 a, 152 b may be approximately 0.1Lambda (wavelength); however, the separation distance may be anydistance that supports signal spatial separation between the antennas.In one variant, deposited between the microstrip patch antennas 152 a,152 b, a fill material, for example, of a dielectric constant (Er)between 3 to 9 allows a decreased separation distance, e.g., to providesmaller electrical packagesize and provide communication signal spatialdifferentiation, between the microstrip patch antennas 152 a, 152 b.

Electrically coupled to the antennas 152 a, 152 b, are low noiseamplifiers 120 a, 120 b (shown in FIG. 1) to increase received signalpower level. During a tracking device startup procedure, e.g., satellitecommunication signal acquisition phase, a receiver 144 receives locationcoordinates, such as GPS coordinates, from one or more base stations orsatellites, such as satellites 302, 304, and 306. The receiver 144mounted on the tracking device 142 to measures a snapshot of a receivesignal strength on patches 152 a, 152 b. Referring to FIG. 1, aftermeasuring a snapshot of signal strength, the low noise amplifiers (LNAs)120 a, 120 b and the receiver 144 and transmitter 146 shifts to a lowpower state, e.g., substantially sleep state with a nominal quiescentcurrent, to reduce current drain; therefore, tracking device batterycharge is conserved. In a low power state, a Global Positioning System(GPS)/Global Positioning Radio System (GPRS) based processor, e.g., anNXP semiconductor GPS processor 150 (see FIG. 1) processes a snapshot,e.g., 10 ms to 100 ms, of raw location coordinates received from each ofthe patches 152 a, 152 b.

In one embodiment, the resulting analysis of the snapshot of rawlocation coordinates determines which of the antennas, e.g., patches 152a, 152 b, predict (based on previous snapshot measurements) betterreceiver sensitivity for future signal acquisition. In anotherembodiment, the resulting analysis from each of the patches 152 a, 152 bprovides information on a percentage of battery power to direct to atracking device's electrical components, e.g., LNAs 120 a, 120 b,patches 152 a, 152 b, to maximize signal directivity of the trackingdevice. Consequently, the invention provides for shifting and/orsupplying power to one or multiple antennas, e.g., first patch 152 a orthe second patch 152 b, in response to a location orientation of thetracking device 142 to a monitoring tower or station, e.g., a basestation or a satellite. Thus, this approach extends battery life of atracking device 142 and provides capability to achieve as close aspossible 360 degree view of the sky.

In contrast, many conventional tracking systems (during startupprocedure) obtain their positional coordinates signal over severalminutes; thus, tracking device battery power is depleted (due to anextended startup procedure). Still other conventional mobile trackingdevice's have one fixed antenna, which may or may not be orientedskyward to a satellite; thus, these systems cause low receiversensitivity and may not provide adequate antenna directivity to receivelocation coordinates of a tracking device. More importantly, otherconventional mobile tracking device's having one or more fixed antennasoriented in one direction deplete available battery level when out oforientation with a skyward satellite or base station than the presentinvention multiple antenna approach that responsively transmits power(e.g., to components (LNA, transceiver, or the like) to an appropriateantenna, e.g., patch 152 a, 152 b, to maximize battery charge.)

In one variant of this embodiment, one or more microstrip patch antennasmay be attached to additional sides of a tracking device (for instanceif the tracking device is square or rectangular shaped) to realizefurther improved tracking device directivity and control and increase areceiver sensitivity to weak signals received skyward from a satelliteor from a base station monitoring tower. In another variant, the LNAsand the transceivers may be replaced by multiple voltages or currentadjustable gain or output power controlled LNAs and/or multiple voltageor current adjustable gain controlled transceiver(s). Continuing withthis variant, the adjustable gain or output power LNAs and/ortransceivers may be electrically coupled and switched into and out of asignal path of one or more of the antennas, e.g., patches 152 a, 152 b,to realize a multi-path, multigrain tracking unit with more options toincrease receiver sensitivity, including attenuation of high power oradjusting a signal level communicated. In still another variant, each ofthe patches 152 a, 152 b may be replaced by one or more antenna patcheson the same side, e.g., a patch array antenna, to achieve additionalsignal acquisition control.

Battery Charging

Referring to FIGS. 4A-4D, various embodiments of battery chargers aredisclosed. Referring to FIG. 4A, the battery charger 420 requires noexternal metal contact points, e.g., DC, RF, and AC inputs. In thisembodiment, the inductive charging pad of the charger 420 provides asurface, e.g., horizontal surface that electrically couples to avoltage/current transformer 424. Wire-wound ferrite inductive cores 408a-d (depicted in FIG. 1 as blocks 131 a-d) are, for instance, mounted onthe circuit board 143 of the tracking device 142 and are electricallycoupled (e.g., using wires) to a switching circuit, e.g., demodulator159, and afterwards to one or rechargeable batteries, e.g., battery 154.About the antenna patches 152 a, 152 b, inductive charging flux pathsthrough the plastic package 142 couple electromagnetic energy from oneor more wire-wound inductive cores, such as ferrite cores 410 a-d,(e.g., located within an inductive charging pad 420) receivingelectrical energy from a computer connection, e.g., USB port 426 toinductive cores 408 a-d. In one embodiment, the inductive charging pad420 provides near field communication between the tracking device 142and a computer monitoring station, such as computer 428. Signaldemodulator 159 demodulates a low frequency signal received frommagnetic flux from the inductive charging pad 420 (e.g., the lowfrequency signal originated from a computer connection, e.g., USB port426.) The near field communication communicates periodic tracking devicesoftware updates, data downloading/uploading, and other tracking devicefirmware updates.

In one embodiment, a voltage/current transformer, e.g., voltage/currenttransformer 421, couples energy, for instance, from a standard AC walloutlet 418 converting a 220V output voltage level, for example, to a 15volt voltage level. In this example, magnetic flux transfer ac flux fromthe inductors 410 a-d to the inductors 408 ad. On the tracking device142, a demodulator circuit 159 and a battery charging circuitry 157provide a dc voltage level to the battery 154 (as shown in FIG. 1).

Referring to FIG. 4B, a dual-sided inductive charging unit 430 (withtransformer 425) charges the tracking device 142 using multiple trackingdevice sides 105, 107 to provide increased battery charging capability.Increased battery charging capability is achieved by an increasedinductive flux contact between inductive components, e.g., 408 a-d,between the tracking device 142 and inductive components, e.g., 410 a-h,within the inductive charging unit 430. In one example, the inductivecharging unit 430 includes a transformer 425 to obtain AC/DC powerand/or low frequency wireless communication from a computer connection,e.g., USB ports 427, 429, of the computer 428. In one variant, inductivecomponents 408 e-h (a second circle of inductors to the tracking device142) may be added to further increase magnetic flux between a trackingdevice and inductive components, e.g., 410 a-h).

Referring to FIGS. 4C, 4D, conformal inductive chargers 432, 434(including one conformal, ferrite core inductor 450), e.g., sideinductive coupled units, are realized with the tracking device 142. Inone example, the inductive chargers 432, 434 connect through atransformer 424 to obtain AC/DC power and/or low frequency wirelesscommunication signals. Referring to FIG. 4E, a tracking device 435 isillustrated having an electrical connector, e.g. USB connector 438, tocharge the battery 154 when electrically coupled between a transformer424, e.g. through a USB connector 426, to a computer 428.

Referring to FIG. 5, a flow chart 500 illustrates one example of aninjection molding process (as described above in FIGS. 2A-2D) inaccordance with one embodiment of the present invention. In step 510,electronic components 141 are placed in the mold tooling 240 (see FIG.2A). In step 520, a thermoplastic resin is injected into the mold (asshown in FIGS. 2B and 2C). In step 264, the electronic components 141are enclosed by the thermoplastic resin as shown in FIGS. 2B and 2C). Instep 530, the mold tooling 240 is removed and the tracking device 142 isformed. In step 540, the tracking device 142 is tested.

Referring to FIG. 6, a flow chart 600 illustrates a signal acquisitionprocedure (as described above in FIG. 3) in accordance with oneembodiment of the present invention. In step 610, a first patch 152 aand a second patch 153 b acquire a snapshot of receive signals. In step620, a processing unit, e.g., 148, 150, processes the snapshot of thereceive signals. In step 640, the processing unit communicates batterypower management instructions to electrical components associated withthe first patch 152 a and the second patch 152 a to increase receiversensitivity, antenna directivity, and maximize battery power usage.

It is noted that many variations of the methods described above may beutilized consistent with the present invention. Specifically, certainsteps are optional and may be performed or deleted as desired.Similarly, other steps (such as additional data sampling, processing,filtration, calibration, or mathematical analysis for example) may beadded to the foregoing embodiments. Additionally, the order ofperformance of certain steps may be permuted, or performed in parallel(or series) if desired. Hence, the foregoing embodiments are merelyillustrative of the broader methods of the invention disclosed herein.

While the above detailed description has shown, described, and pointedout novel features of the invention as applied to various embodiments,it will be understood that various omissions, substitutions and changesin the form and details of the device or process illustrated may be madeby those skilled in the art without departing from the spirit of theinvention. The foregoing description is of the best mode presentlycontemplated of carrying out the invention. This description is in noway meant to be limiting, but rather should be taken as illustrative ofthe general principles of the invention. The scope of the inventionshould be determined with reference to the claims.

1. A charging device comprising: a receiving component configured toreceive electrical energy from an electrical energy source; and anelectrical energy transfer component configured to inductively providestorable electrical energy to a portable electronic device and totransfer data between the portable electronic device and a computermonitoring station.
 2. The charging device of claim 1, wherein theelectrical energy transfer component comprises an inductive charging padthat provides near-field communication between the portable electronicdevice and the computer monitoring station.
 3. The charging device ofclaim 2, wherein the inductive charging pad is configured to communicatesoftware and firmware updates to the portable electronic device.
 4. Thecharging device of claim 1, wherein the receiving component isconfigured to receive electrical energy from an AC electrical powersource, the charging device comprises a transformer to convert the ACelectrical energy to DC electrical energy, and the electrical energytransfer component is configured to inductively provide the DCelectrical energy to the portable electronic device.
 5. The chargingdevice of claim 1, wherein the receiving component is configured toreceive electrical energy from a DC electrical power source.
 6. Thecharging device of claim 1, wherein the receiving component isconfigured to receive electrical energy from the computer monitoringstation.
 7. The charging device of claim 1, wherein the electricalenergy transfer component comprises a plurality of inductive chargingpads that provide near-field communication between a plurality ofportable electronic devices and one or more computer monitoringstations.
 8. The charging device of claim 2, wherein the inductivecharging pad is configured to have a shaped opening such that theportable device fits at least partially inside the shaped opening of theinductive charging pad.
 9. A tracking device comprising: an inductivecomponent configured to inductively receive electrical energy from acharging device; an energy storage component configured to store theelectrical energy received from the charging device; and a processorconfigured for two way communications between the tracking device and acommunications satellite and configured to transfer data between thetracking device and a computer monitoring station via the chargingdevice.
 10. The tracking device of claim 9, wherein the inductivecomponent is configured to communicate with at least one of the chargingdevice and the computer monitoring station through near-fieldcommunication.
 11. The tracking device of claim 9, wherein the inductivecomponent is configured to receive software and firmware updates from atleast one of the charging device and the computer monitoring station.12. The tracking device of claim 9, wherein a housing of the trackingdevice is configured to at least partially fit inside a shaped spaceformed by a shaped inductive charging pad of the charging device.
 13. Asystem comprising: a tracking device comprising: an inductive componentconfigured to inductively receive electrical energy, an energy storagecomponent configured to store the electrical energy, and a processorconfigured for two way communications between the tracking device and acommunications satellite and configured to transfer data between thetracking device and a computer monitoring station; and a charging devicecomprising: a receiving component configured to receive an electricalenergy from a electrical energy source, and an electrical energytransfer component configured to inductively provide storable electricalenergy to the inductive component of the tracking device and tocommunicatively couple the tracking device to the computer monitoringstation when the tracking device is in close proximity to the chargingdevice.
 14. The system of claim 13, wherein the electrical energytransfer component comprises an inductive charging pad that providesnear-field communication between the tracking device and the computermonitoring station.
 15. The system of claim 14, wherein the inductivecharging pad is configured to communicate software and firmware updatesto the tracking device.
 16. The system of claim 13, wherein thereceiving component is configured to receive electrical energy from anAC electrical power source, the charging device comprises a transformerto convert the AC electrical energy to DC electrical energy, and theelectrical energy transfer component is configured to inductivelyprovide the DC electrical energy to the tracking device.
 17. The systemof claim 13, wherein the receiving component is configured to receiveelectrical energy from a DC electrical power source.
 18. The system ofclaim 13, wherein the receiving component is configured to receiveelectrical energy from the computer monitoring station.
 19. The systemof claim 13, wherein the electrical energy transfer component comprisesa plurality of inductive charging pads that provide near-fieldcommunication between a plurality of portable electronic devices and oneor more computer monitoring stations, and wherein at least one of theplurality of portable electronic devices is the tracking device.
 20. Thesystem of claim 14, wherein the inductive charging pad is configured tohave a shaped opening such that the portable device fits at leastpartially inside the shaped opening.